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JAPANESE Privacy Policy Site map Contact JAPANESE Image Processing Measuring Machine /Calibration of Measuring Instruments and Machines Image Processing Measuring Instruments Image Processing Measuring Instruments TOP Image Processing Measuring Machines White Light Interferometric Microscope Application Application TOP OLED(Organic EL Display) LCD(Liquid Crystal Displays) Touchscreens Fiber Optic Connectors MEMS(Micro Electro Mechanical Systems) Electronic Component IC Package PCB(Printed Circuit Board) JCSS Calibration Service JCSS Calibration Service Sintoʼs JCSS Accredited Calibration Service About calibration Contact Image Processing Measuring Machine / Calibration of Measuring Instruments and Machines TOP Application Dimensional Measurements of IC Package Dimensional Measurements of IC Package IC packaging technology is rapidly becoming high-density and three-dimensional due to the accelerating advance of semiconductor functionality. Sinto's dimensional measurement technology is applied to the manufacturing process of IC package substrates, represented by the state-of-the-art high-density FC-BGA. Measurement of FC-BGA Packages Measurement Outline Mainly measures the electrical connection between the BGA board and the IC side or outside. Since not only the measurements of position and diameter of the area where the bumps connect, but also of the uniform height of the bumps become important, an optional laser auto focus displacement meter is used to measure the height of the land before the molding of the bumps and the uniformity (co-planarity) of the height of the bumps after molding. Related products Basic Models for Workpieces Small and Large Automatic 2D/3D CMMAMIC Series Measurement of Lead Frame A component called a lead frame, which is made from the processing of the thin metal sheet and acts as a connection between the IC and the outside part, is used in IC packages. Advancements are being made year by year to the intricacy of the inner lead in particular, which is the component connecting to the IC side. This makes the measurement of this part increasingly important. Measurement Outline Measurements are made of the width and spacing of the inner and outer leads and of the dimensions of the IC mounted area (Die Pad ). Measurement of width and spacing of the part requested by a user is possible through a special measurement program used especially during measurement of the inner lead Related products Basic Models for Workpieces Small and Large Automatic 2D/3D CMMAMIC Series Measurement of Photomask Photolithography technology is used for the patterning of high-density packaging components, whereby patterns are baked onto a glass base plate. We measure the pattern position, line width / space and diameter of photomasks, which are mainly used as original plates. The optional software C-Auto enables the creation of measurement program based on CAD data, which is pattern design data, to improve work efficiency. Related products High Precision Models Precision Automatic 2D CMM (Coordinate Measuring Machines)SMIC Series Please consult us for inquiries. +81-52-582-9217 +81-52-581-6896 Available hours: 9:00-12:00 and 13:00-17:00 JST, Monday through Friday(excluding national and corporate holidays) Please enter your question here. Product information Surface treatment Applications and usage examples Products Topics for surface treatment Foundry Green sand molding V-Process Chemically bonded Aluminum casting Environment Dust collection Dust fire prevention systems Exhaust gas treatment Water treatment Powder treatment Force sensors Electric cylinders Material handling Image Processing Measuring Machine / Calibration of Measuring Instruments and Machines Electronic core materials Ceramics Flooring --> Healthcare and pharmaceuticals About SINTO Corporate profile Our brand and philosophy Corporate message Business fields History Locations in Japan Group companies (domestic/overseas) IR library Site map Privacy Policy Copyright SINTOKOGIO, LTD. All Rights Reserved.